8-inch laser dicing machine with dicing frame handling system.

We have developed a dicing machine equipped with stealth dicing technology (developed by Hamamatsu Photonics) as a stealth dicing engine, exhibiting excellent performance.

Feature1

High Quality Prosessing

nDicing of thin wafers (30μm) made possible

The ML200plus FH makes high speed dicing (300mm/s) of thin wafers possible.

nMinimal Chipping

Chipping has been redically minimized.

nCompletely Dry Process

As a completely dry process is used, this prosessing technology is perfectly suited to devices averse to moisture, such as optical devices.

High Throughput

nDices 4 Times Faster than Blade Dicing

The ML200Plus FH is able to dice thin wafers of thickness 100μm or thinner at a speed of 300mm/s, contributing significantly to improved throughput.

Large Increases in Chip Yield

nThe kerf loss necessary for blade dicing has been reduced to 0μm with ML200Plus FH, and dramatic reduction in dicing street width has been made possible. This technology pushes chip yield per wafer to the maximum limit.

Improved Yield

nImprovements Made in Flexural Strength

As wafers are cut internally, avoiding any damage to the wafer surface, chipping on the bottom surface of the wafer is minimized, flexural strength is improved, and breaking strengh when wafers are picked during the packaging process is improved, improving tact in the die bonder process as well as contributing to better yield.

nDices 4 Times Faster than Blade Dicing

The ML200Plus FH is able to dice thin wafers of thickness 100μm or thinner at a speed of 300mm/s, contributing significantly to improved throughput.

Feature2

Reduced Operations Costs

nNo Waste Water Disposal Required

When processed, the modification layer is formed within the Si, meaning that dust is radically reduced, and resources are not spent on waste water disposal costs.

nNo Blade Replacement Required

The ML200Plus FH does not use blades, meaning that blade costs are reduced, and labor is not required for blade replacement and quality control of blade wear and tear.

nNo Dicing Water Required

The process is completely dry, meaning that no 01 water is used. As no contamination occurs, cleaning processes are also unnecessary.